Introduction to X-Ray Inspection

Course Description

This 3-hour class introduces students to x-ray inspection and how it fits into the broader context of electronics manufacturing.

Who should attend?

This course is for anyone who would benefit from understanding x-ray technology as it relates to electronics manufacturing; this includes engineers, quality personnel, production personnel, and x-ray operators.

Prerequisites

·Proficiency with technical English

 

Class Size

15 students maximum

Available Formats

·Training Center
·On-site
·Virtual

Course Outline

Module 1 – X-Ray Basics

•X-Ray Terms & Equipment
•How X-Rays Work
•X-Ray Viewing Angles
•X-Ray defects
•

Module 2 – Understand the X-Ray System

•2D vs 3D
•Detectors
•Exposure & Current
•Resolution & Magnification
•

Module 3 – X-Ray Defects

•Voids
•Through-hole
•Chip-Component
•LGA Termination
•Gull Wing
•Thermal Pad
•Cracks & Fractures
•Through-hole – Fill, Inspection
•BGA Voids, BGA ball inspection
•Bridging
•Head-in-Pillow
•Separation
•Opens
•Alignment
•FOD
To inquire about scheduling, please email training@circuittechnology.com