Lead free alloys characteristics are discussed and the differences and similarities explored. The student will become familiar with the IPC component identification desk reference manuals and workmanship standards as they pertain to SMT technology. The class will be introduced to surface mount technology and be asked, after appropriate demonstrations, to construct a SMT board. Types of components are varied and include components ranging from 1206 chip components, SOT’s, SOIC’s PLCC’s to fine pitch gull wing devices. All students will be required to install some components using lead free solders.

Upon completion of all component types the students will remove the components using a variety of conductive and convective methodology. The goal is to remove all components without inducing damage to the board. Upon successful completion of the course students will receive a Circuit Technology Certification good for a period of two years.

Hands-On Course

This is a comprehensive hands-on course designed for the beginner to intermediate soldering and rework technician. It will instruct the student on:

• Protection of electronic circuitry from the hazards of ESD (Electrostatic Discharge)

• Basic component identification

• Workmanship standards

• Basic skills in SMT (surface mount technology) installation

• Removal using state of the art workstations

Course Structure

The course is structured to be in accordance with IPC-610, 7711 and J standard:

• Basic ESD concepts

• Minimizing ESD in the workplace

• General ESD rules

• General IPC terms and definitions (product classifications, acceptance criteria, etc.)

• Selected common electronic terms

Solder/Desolder Rework

The class will familiarize themselves with the solder/desolder rework stations and become comfortable with soldering tip care and safety. The class will study the basics of soldering including the nature of:

• Fluxes

• Proper cleaning methodology

• Formation of intermetallics

• Solder melting points, etc.

Mixed SMT and PTH

This is a comprehensive hands-on course designed for the beginner to intermediate level solderer. It will instruct the student on protection of electronic circuitry from the hazards of ESD (Electrostatic Discharge), basic component identification, and workmanship standards. This is a hands-on course that will teach the candidates basic skills in PTH (pin-through-hole) and SMT (surface mount technology) installation and removal using state of the art workstations. The course is structured to be in accordance with IPC-A-610 and IPC 7711. Upon successful completion of the course students will receive a Circuit Technology Certification good for a period of two years.

Day 1

The student will become familiar with:

• Basic ESD concepts

• Minimizing ESD in the workplace

• General ESD rules

• View the IPC ESD video

• Introduction to general IPC terms/definitions (product classifications, acceptance criteria, etc.)

• Selected common electronic terms

• PACE MBT 250 or MBT 350 rework stations

• Soldering tip care and safety

Day 2

The class will study the basics of soldering including:

• The nature of fluxes

• Proper cleaning methodology

• Formation of intermetallics

• Solder melting points, etc.

Day 3

The student will:

• Build the PTH board while his/her workmanship is constantly evaluated and suggestions made to improve their technique.

• Build a functional circuit that can be removed from the board and used as a workmanship sample for his employer

• Remove all the components on their board using vacuum extraction techniques.

Day 4

The class will be introduced to surface mount technology and be asked, after appropriate demonstrations, to construct a SMT board. Types of components are varied and include components ranging from 1206 chip components to fine pitch gull wing devices.

Day 5

The student will continue to build their SMT board. Upon completion of all component types the students will remove the components using a variety of conductive and convective methodology. The goal is to remove all components without inducing damage to the board. 

This is a three-day course designed to refine the student’s skills in the installation and removal of complex surface mount assemblies including BGA, micro BGA, QFN and ultra fine pitch SMD’s. Curriculum includes attaching thermocouples to devices and boards to capture a real-time image of their thermal characteristics and use that information to create the correct profile for removals and replacements. The student will also use an X-Ray inspection system and a look under microscope to inspect and characterize defects associated with leadless devices.

Day 1

The student will become familiar with:

• Lecture: (approx. 4 hours)

• Basics of soldering discussion-Composition of solder

• Eutectic vs. non-eutectic

• Flux and its role in the soldering operation

• Formation of intermetallics

• Cleaning operations concerning leadless devices

• Introduction to BGA’s

• Common packages (PBGA/CBGA/CCGA/CSP/µBGA)

• Developing the Rework Process Profiling

• Attachment of thermo-couples

• Reflow Parameters

• Site Preparation

• Basic Installations and Removals

• Nozzle Features and Selection

• Inspection Techniques

• Reballing Techniques

Remainder of day concentrates on:

• familiarization with machine

• machine controls

• machine calibration

• preventive maintenance

Day 2

• Attach thermo-couples and develop time/temperature profiles for various devices

• Install various BGA, CSP, and µBGA packages using the profiles developed earlier

• Utilize X-Ray techniques to characterize various defects associated with leadless devices

 Day 3

• Remove selected components using profiles developed earlier

• Learn various methods of preparing sites for reinstallation of devices

• Be introduced to reballing techniques and develop profiles accordingly

These courses are designed to enhance the quality of your final product by optimizing your processes through an interactive hands on training process for your engineers and operators.

Each training begins with the instructor gathering offline information about your facility and processes to begin the customization process. When onsite, the trainer begins with a comprehensive audit of your equipment and processes. We then adapt our curriculum to your specific requirements. A targeted classroom session based around the facts gathered both onsite and from the pre site audit then begins. We also integrate actual machine time to re-enforce the classroom discussions and exercises. Actual real time production problem solving ties all the exercises together. The last exercise is to implement the process knowledge and improvements on your production line.

Wave Solder Process

This course provides hands on and theoretical wave solder process training. Topics include:

• Theory of operation

• Basics of soldering

• Machine parts and their function

• Machine maintenance and preventive maintenance

• The 5 keys to process perfection

• Profiling

• Verification

• Troubleshooting

Target audience: Wave solder process engineers and operators. Prerequisites: Basic knowledge of wave solder machines, tools, meters and schematics.

Reflow Solder Process

This course provides hands on and theoretical reflow solder process training. Topics include:

• Theory of operation

• Basics of soldering

• SMT and TH (intrusive) reflow

• Machine parts and their function

• Machine maintenance and preventive maintenance

• The 5 keys to process perfection

• Profiling

• Verification

• Troubleshooting

Target audience: SMT solder process engineers and operators. Prerequisites: basic knowledge reflow ovens, tools, meters and schematics.

 Other Industries/Techniques

• ESD

• Component ID

• ComboTech Rework

• Medical Device Assembly

• Schematic Reading

 To request more information about Application Specific Classes, click on this link to get to the request form: https://circuittechnology.com/Customized-Class-Request

This class is designed to introduce the student to the basics of automated SMT and PTH assembly. The student will be given an overview of the print, placement, reflow, inspection, test, and wave/selective soldering processes. In depth discussion of process parameters associated with each process, typical defects and how to correct them. Curriculum includes classroom and practical lab working on the equipment. The successful students will be awarded a Circuit Technology Certification of Completion.

Module 1

• Introduction and overview of the SMT assembly process.

• “Basics of Soldering” including alloys, fluxes, solder paste, rheology and intermetallic bond.  Hands on lab included.

• RoHS

Module 2

• SMT component Identification using samples and concentrating on industry recognized standards and terminology.  Component handling, ESD, MSD and contamination/solderability included.

• IPC-J-standard 001 and supporting documents 002-006, T-50 review

• IPC-610 review

Module 3

• Analysis of bare board design, types and workmanship standards and inspection criteria.

• IPC-600 and 6012 review

Module 4

• Analysis of the stencil printing process including using Gerber data to manufacture stencils, different stencil considerations, squeegee selection and considerations, etc.  Paste deposition will be discussed along with common defects found during the stenciling process and the best resolution.  Hands on at the printer.

• US vs Japanese printing standards-stencil size

• Stencil design

  • Chem-etch, laser cut, e-form
  • Aperture designs
  • IPC-7525 stencil design guidelines

• Printing parameters

  • Squeegee speed and pressure
  • On contact vs off contact printing
  • Under stencil wiping-wet and dry
  • Paste inspection
  • Defects typically associated with the printing process
    • Shorts/insufficient solder/excess solder/misaligned solder

Module 5

• Analysis of component placement process, machine types, where typical defects can occur and the best resolution.  Hands on at the placement machines.

• Machine architecture

  • Turret-Fuji, Hitachi and Panasonic
  • Modular-all manufacturers now
  • Hybrid machines-Juki and Universal

Module 6

• Analysis of the reflow process and profiling.  How to build a robust SMT profile, typical defects and the best resolution.  Hands on at the reflow oven.

  • Straight ramp vs ramp/soak/spike, cooling
  • Effects of N2
  • Defects causes by improper profile
    • Component shock
    • Solder balls/solder beads/graping
    • Tombstone
    • Head in pillow
    • Bridges
    • Insufficient reflow
    • Over cure
    • Bare board delamination

Module 7

• Analysis of the wave solder and selective solder process including profile generation, flux application and defect recognition/root cause analysis.  Hands on at the wave solder machine.

• Flux application-spray, foam, drop jet

• Effects of N2

• Defects at the wave

  • Poor topside fill
  • Insufficient circumferential fill
  • Solder balls
  • Skips
  • Part float
  • Missing parts-SMT
  • Bare board delamination
  • Non wetting/de-wetting
  • Copper dissolution
  • Excessive flux, pallet “gasketing”
  • dross

Module 8

• Analysis of the assembled PCB inspection process including automated and manual techniques.  Hands on lab included.

• IPC-610 criterion

• Manual vs automated inspection

• 3D inspection

Module 9

Overview of the test process including ICT, flying probe and functional.

Module 10

• Cleaning

  • Why Clean
  • Cleaning Chemistries
  • Manual Cleaning
  • Cleaning Equipment – Automated Cleaning
    • Vapor Degreaser
    • Aqueous/Semi Aqueous-Batch and In-Line
    • Stencil Cleaning

Module 11

• PCB Transport and  Handling

  • Conveyors
  • Loaders and Unloaders – Bare Board and Magazine
  • Buffers
  • Cooling Towers

Module 12

• Analysis of the PCB rework process including TH, SMT, BGA and pad repair.  Hands on lab included.

• IPC-7711 overview

3-Day Course

This 3-day course is designed to focus primarily on lead-free soldering techniques as applied to TH technology, SMT and inspection. The student will gain a basic understanding of lead-free alloys and their advantages and disadvantages plus a more detailed knowledge of soldering in accordance with IPC-J standard, IPC 7711/7721 and IPC-610.

Module 1 Basics of Soldering 4 Hours

Solder/flux/solder paste-alloys, lead free alloys and their advantages/disadvantages, reflow temperatures, rheology Component ID ESD MSD Tip care and maintenance In accordance with IPC-J standard 001

Module 2 TH Technology, Wires and Terminals 6 Hours

TH soldering and removal Barrel/annular ring repair Soldering wires and terminals In accordance with IPC-J standard 001 and IPC-7711/7721

Module 3 SMT 8 Hours

SMT soldering and removal of chip caps, resistors, SOIC’s, PLCC, QFP’s, QFN’s Track and pad repair in accordance with IPC-J standard 001 and IPC-7711/7721

Module 4 Inspection 6 Hours

Inspection to class 1, 2 and 3 In accordance with IPC-610