Combotech

Mixed SMT and PTH

This is a comprehensive hands-on course designed for the beginner to intermediate level solderer. It will instruct the student on protection of electronic circuitry from the hazards of ESD (Electrostatic Discharge), basic component identification, and workmanship standards. This is a hands-on course that will teach the candidates basic skills in PTH (pin-through-hole) and SMT (surface mount technology) installation and removal using state of the art workstations. The course is structured to be in accordance with IPC-A-610 and IPC 7711. Upon successful completion of the course students will receive a Circuit Technology Certification good for a period of two years.

Day 1

The student will become familiar with:

  • Basic ESD concepts

  • Minimizing ESD in the workplace

  • General ESD rules

  • View the IPC ESD video

  • Introduction to general IPC terms/definitions (product classifications, acceptance criteria, etc.)

  • Selected common electronic terms

  • PACE MBT 250 or MBT 350 rework stations

  • Soldering tip care and safety

Day 2

The class will study the basics of soldering including:

  • The nature of fluxes

  • Proper cleaning methodology

  • Formation of intermetallics

  • Solder melting points, etc.

Day 3

The student will:

  • Build the PTH board while his/her workmanship is constantly evaluated and suggestions made to improve their technique.

  • Build a functional circuit that can be removed from the board and used as a workmanship sample for his employer

  • Remove all the components on their board using vacuum extraction techniques.

Day 4

The class will be introduced to surface mount technology and be asked, after appropriate demonstrations, to construct a SMT board. Types of components are varied and include components ranging from 1206 chip components to fine pitch gull wing devices.

Day 5

The student will continue to build their SMT board. Upon completion of all component types the students will remove the components using a variety of conductive and convective methodology. The goal is to remove all components without inducing damage to the board.