This class is designed to introduce the student to the basics of automated SMT and PTH assembly. The student will be given an overview of the print, placement, reflow, inspection, test, and wave/selective soldering processes. In depth discussion of process parameters associated with each process, typical defects and how to correct them. Curriculum includes classroom and practical lab working on the equipment. The successful students will be awarded a Circuit Technology Certification of Completion.
Introduction and overview of the SMT assembly process.
“Basics of Soldering” including alloys, fluxes, solder paste, rheology and intermetallic bond. Hands on lab included.
SMT component Identification using samples and concentrating on industry recognized standards and terminology. Component handling, ESD, MSD and contamination/solderability included.
IPC-J-standard 001 and supporting documents 002-006, T-50 review
Analysis of bare board design, types and workmanship standards and inspection criteria.
IPC-600 and 6012 review
Analysis of the stencil printing process including using Gerber data to manufacture stencils, different stencil considerations, squeegee selection and considerations, etc. Paste deposition will be discussed along with common defects found during the stenciling process and the best resolution. Hands on at the printer.
US vs Japanese printing standards-stencil size
Analysis of component placement process, machine types, where typical defects can occur and the best resolution. Hands on at the placement machines.
Analysis of the reflow process and profiling. How to build a robust SMT profile, typical defects and the best resolution. Hands on at the reflow oven.
Analysis of the wave solder and selective solder process including profile generation, flux application and defect recognition/root cause analysis. Hands on at the wave solder machine.
Flux application-spray, foam, drop jet
Effects of N2
Defects at the wave
Analysis of the assembled PCB inspection process including automated and manual techniques. Hands on lab included.
Manual vs automated inspection
Overview of the test process including ICT, flying probe and functional.
PCB Transport and Handling
Analysis of the PCB rework process including TH, SMT, BGA and pad repair. Hands on lab included.