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CTTi — Circuit Technology Training Inc.
CTTi Custom

CTTi-XR

Intro to X-Ray Inspection

BGA and hidden-joint inspection fundamentals.

Duration
2 days
Price
$1,195/ student
Format
In-person · Onsite
Overview

BGA and hidden-joint inspection fundamentals.

Curriculum

Curriculum

  1. X-Ray Basics

    • X-ray terms & equipment
    • How X-rays work
    • X-ray viewing angles
    • X-ray defects
  2. Understand the X-Ray System

    • 2D vs 3D
    • Detectors
    • Exposure & current
    • Resolution & magnification
  3. X-Ray Defects

    • Voids
    • Through-hole
    • Chip-component
    • LGA termination
    • Gull-wing
    • Thermal pad
    • Cracks & fractures
    • Through-hole fill/inspection
    • BGA voids & ball inspection
    • Bridging
    • Head-in-pillow
    • Separation
    • Opens
    • Alignment
    • FOD
Learning objectives
  • Understand X-ray inspection principles and safety
  • Interpret 2D and oblique X-ray images of solder joints
  • Detect hidden defects such as BGA voids, opens, and shorts
  • Apply X-ray to inspect area-array and otherwise hidden connections
  • Understand when X-ray complements visual inspection
Prerequisites

No prior certification is required; assembly or inspection familiarity is helpful.

  • Ability to read and understand technical documents in English
  • Familiarity with electronic assembly or inspection
Rated 5 out of 5

I have trained with Angel at Circuit Technology for nearly 10 years now. The knowledge and support are second to none. If you need IPC training, this is the best option available.

Fe SeamonNew York Air Brake LLC

Upcoming sessions

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