Aug 10 – 12, 2026
CTTi Custom- Duration
- 5 days
- Price
- $1,995
- Format
- In-person · Onsite
Overview
Intensive onboarding for new SMT technicians.
Curriculum
Curriculum
Soldering fundamentals & SMT process overview
- Introduction and overview of the SMT assembly process
- “Basics of Soldering”: alloys, fluxes, solder paste, rheology and intermetallic bond, with hands-on lab
- RoHS
Component ID, ESD/MSD & IPC standards
- SMT component identification, handling, ESD, MSD and contamination/solderability
- IPC J-STD-001 and supporting documents 002–006, T-50 review
- IPC-A-610 review
Bare-board design & workmanship standards
- Analysis of bare-board design, types and workmanship standards
- IPC-600 and 6012 review
Stencil printing & solder paste
- Stencil printing process analysis, Gerber data, squeegee selection
- US vs Japanese printing standards
- Stencil design (chem-etch, laser cut, e-form, aperture designs, IPC-7525)
- Printing parameters and defect analysis
Component placement
- Component placement process, machine types and defect analysis with hands-on training
- Machine architecture (turret, modular, hybrid)
Reflow profiling
- Reflow process profiling and robust profile development with hands-on oven training
- Defect causes: component shock, solder balls, tombstone, head-in-pillow, bridges
Wave & selective soldering
- Wave and selective solder process analysis with hands-on training
- Flux application methods and defect recognition
PCB inspection
- Assembled-PCB inspection (automated and manual) with hands-on lab
- IPC-A-610 criteria and 3D inspection
Test processes
- Test process overview (ICT, flying probe, functional)
Cleaning processes
- Cleaning rationale, chemistries and equipment (vapor degreaser, aqueous/semi-aqueous, stencil cleaning)
PCB transport & handling
- Conveyors, loaders, unloaders, buffers, cooling towers
Rework & repair
- PCB rework process analysis (TH, SMT, BGA, pad repair) with hands-on lab
- IPC-7711 overview
Learning objectives
- Understand the surface-mount assembly process end to end
- Identify common SMT components, packages, and footprints
- Perform basic SMT placement and soldering techniques
- Recognize common SMT defects and their causes
- Apply ESD-safe handling practices
- Build a foundation for IPC certification courses
Prerequisites
Designed for newcomers — no prior experience is required.
- Ability to read and understand technical documents in English
- Visual acuity to distinguish fine detail and color (corrective lenses or magnification permitted)
Intensive onboarding for new SMT technicians.
Curriculum
Soldering fundamentals & SMT process overview
- Introduction and overview of the SMT assembly process
- “Basics of Soldering”: alloys, fluxes, solder paste, rheology and intermetallic bond, with hands-on lab
- RoHS
Component ID, ESD/MSD & IPC standards
- SMT component identification, handling, ESD, MSD and contamination/solderability
- IPC J-STD-001 and supporting documents 002–006, T-50 review
- IPC-A-610 review
Bare-board design & workmanship standards
- Analysis of bare-board design, types and workmanship standards
- IPC-600 and 6012 review
Stencil printing & solder paste
- Stencil printing process analysis, Gerber data, squeegee selection
- US vs Japanese printing standards
- Stencil design (chem-etch, laser cut, e-form, aperture designs, IPC-7525)
- Printing parameters and defect analysis
Component placement
- Component placement process, machine types and defect analysis with hands-on training
- Machine architecture (turret, modular, hybrid)
Reflow profiling
- Reflow process profiling and robust profile development with hands-on oven training
- Defect causes: component shock, solder balls, tombstone, head-in-pillow, bridges
Wave & selective soldering
- Wave and selective solder process analysis with hands-on training
- Flux application methods and defect recognition
PCB inspection
- Assembled-PCB inspection (automated and manual) with hands-on lab
- IPC-A-610 criteria and 3D inspection
Test processes
- Test process overview (ICT, flying probe, functional)
Cleaning processes
- Cleaning rationale, chemistries and equipment (vapor degreaser, aqueous/semi-aqueous, stencil cleaning)
PCB transport & handling
- Conveyors, loaders, unloaders, buffers, cooling towers
Rework & repair
- PCB rework process analysis (TH, SMT, BGA, pad repair) with hands-on lab
- IPC-7711 overview
- Understand the surface-mount assembly process end to end
- Identify common SMT components, packages, and footprints
- Perform basic SMT placement and soldering techniques
- Recognize common SMT defects and their causes
- Apply ESD-safe handling practices
- Build a foundation for IPC certification courses
Designed for newcomers — no prior experience is required.
- Ability to read and understand technical documents in English
- Visual acuity to distinguish fine detail and color (corrective lenses or magnification permitted)
“I have trained with Angel at Circuit Technology for nearly 10 years now. The knowledge and support are second to none. If you need IPC training, this is the best option available.”
Upcoming sessions
August 2026
- In-personAvailable
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