CTTi CustomCTTi-ADV
Advanced SMT & PTH
Advanced surface mount and plated through-hole techniques.
- Duration
- 4 days
- Price
- $1,895
- Format
- In-person · Onsite
Overview
Advanced surface mount and plated through-hole techniques.
Curriculum
Curriculum
Day 1 — Lecture (~4 hrs)
- Basics of soldering (composition of solder; eutectic vs. non-eutectic)
- Flux and its role
- Formation of intermetallics
- Cleaning operations for leadless devices
- Introduction to BGAs
- Common packages (PBGA/CBGA/CCGA/CSP/µBGA)
- Developing the rework process profile
- Attachment of thermocouples
- Reflow parameters
- Site preparation
- Basic installations and removals
- Nozzle features and selection
- Inspection techniques
- Reballing techniques
Day 1 — Machine familiarization
- Familiarization with machine
- Machine controls
- Machine calibration
- Preventive maintenance
Day 2 — Profiling & installation
- Attach thermocouples and develop time/temperature profiles for various devices
- Install BGA, CSP, and µBGA packages using the profiles
- Use X-ray techniques to characterize leadless-device defects
Day 3 — Removal & reballing
- Remove selected components using the developed profiles
- Methods of preparing sites for reinstallation
- Introduction to reballing techniques and profile development
Learning objectives
- Apply advanced surface-mount and plated-through-hole techniques
- Hand-solder fine-pitch and high-density assemblies
- Apply thermal management and process control for difficult parts
- Diagnose and correct complex assembly defects
- Optimize technique for challenging component types
Prerequisites
An advanced course — prior soldering experience is expected.
- Prior soldering experience (SMT Bootcamp or J-STD-001 recommended)
- Ability to read and understand technical documents in English
- Visual acuity to distinguish fine detail and color (corrective lenses or magnification permitted)
Advanced surface mount and plated through-hole techniques.
Curriculum
Day 1 — Lecture (~4 hrs)
- Basics of soldering (composition of solder; eutectic vs. non-eutectic)
- Flux and its role
- Formation of intermetallics
- Cleaning operations for leadless devices
- Introduction to BGAs
- Common packages (PBGA/CBGA/CCGA/CSP/µBGA)
- Developing the rework process profile
- Attachment of thermocouples
- Reflow parameters
- Site preparation
- Basic installations and removals
- Nozzle features and selection
- Inspection techniques
- Reballing techniques
Day 1 — Machine familiarization
- Familiarization with machine
- Machine controls
- Machine calibration
- Preventive maintenance
Day 2 — Profiling & installation
- Attach thermocouples and develop time/temperature profiles for various devices
- Install BGA, CSP, and µBGA packages using the profiles
- Use X-ray techniques to characterize leadless-device defects
Day 3 — Removal & reballing
- Remove selected components using the developed profiles
- Methods of preparing sites for reinstallation
- Introduction to reballing techniques and profile development
- Apply advanced surface-mount and plated-through-hole techniques
- Hand-solder fine-pitch and high-density assemblies
- Apply thermal management and process control for difficult parts
- Diagnose and correct complex assembly defects
- Optimize technique for challenging component types
An advanced course — prior soldering experience is expected.
- Prior soldering experience (SMT Bootcamp or J-STD-001 recommended)
- Ability to read and understand technical documents in English
- Visual acuity to distinguish fine detail and color (corrective lenses or magnification permitted)
“I have trained with Angel at Circuit Technology for nearly 10 years now. The knowledge and support are second to none. If you need IPC training, this is the best option available.”