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Circuit Technology, Inc.
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(919) 552-3434 phone
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IPC-4553A                                                        
Specification for Immersion Silver Plating for Printed Boards                                                
This specification sets requirements based on performance criteria for the use of Immersion Silver (IAg) as a surface finish for printed circuit boards. It is intended for use by chemical suppliers, printed board manufacturers, electronics manufacturing services (EMS) companies and original equipment manufacturers (OEM). IAg is a thin immersion deposit over copper. It is a multifunctional surface finish, applicable to soldering. It may also be applicable for some press fit connections and as a contact surface. It has the potential to be suitable for aluminum wire bonding. The immersion silver protects the underlying copper from oxidation over its intended shelf life. Exposure to moisture and air contaminants, such as sulfur and chlorine, may negatively impact the useful life of the deposit. The impact can range from a slight discoloration of the deposit to the pads turning completely black. Proper packaging is a requirement. Note that, in this revision, both a single thickness range is in place and an upper limit for immersion silver thickness has been established. 36 pages. Released May 2009.

ENVSYM309-CD
It's Not Easy Being Green: Compliance with Legislation & Customer Requirements
Proceedings of IPC's Symposium on Electronics and the Environment, "It's Not Easy Being Green: Compliance with Legislation & Customer Requirements" Includes presentations on RoHS, REACH, California Environmental Issues, Sustainability, Corporate Social Responsibility, Halogen-Free Electronics. Includes presentations from CISCO, Department of Toxic Substances Control, Design Chain Associates, Green Blue Institute, Albemarle Corporation, Intel, Hewlett-Packard, Flextronics and more. Released March 2009.

J-STD-002C-CN
Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires - Includes Amendment 1 - Chinese Language
This is the Chinese Language version of J-STD-002C.

This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users. The Amendment 1 now included in this IPC/ECA J-STD-002C adds an appendix that defines a test protocol for wetting balance testing and also allows the use of production solder pastes of appropriate lead-based and lead free compositions for surface mount simulation testing. 63 pages. Released November 2008.
Hard copy:
IPC Member Price $31.00
Nonmember Price $62.00

6017
Qualification and Performance Specification for Printed Boards Containing Embedded Passive Devices
This new standard supplements existing IPC-6010 series specifications with qualification and performance requirements for in-process and finished printed boards containing embedded passive circuitry (distributive capacitve planes and capacitive or resistive components). 10 pages. Released March 2009.
Included in Collections C-105, C-1000 and the 6010 Series
Hard Copy:
IPC Member Price $26.00
Nonmember Price $52.00
Additional electronic format prices are available through the link above.

EMBPASWP309
An IPC White Paper: Embedded Passives: An Overview of Implementation, Benefits and Costs
Embedded passives technology is critical to the industry. With this technology, PCB manufacturers can increase functionality, speed and portability. There are many sources of information on embedded passives, and it can be overwhelming to gather data. This whitepaper provides an overview of embedded passives from multiple sources to help the reader perform a basic cost/benefits analysis regarding embedded passives and make initial decisions regarding implementation. 18 pages. Released February 25, 2009.

Member price: $25.00
Non member price:  $50.00

This white paper is only available by purchase.

Benefits of OVT
With the added convenience of 24/7 access from any workstation throughout your facility, these Online Video Training (OVT) programs deliver video on demand over your network infrastructure, or over your intranet -- for online and distance learning applications.  Now, any computer in your organization can be an instant online training center!  It's cost-effective, easy-to-implement, and includes the entire contents of their DVD training counter-parts.


Ray's Lead Free Hand Soldering Secrets
Learn the secret solutions for overcoming the problems associated with hand soldering of lead-free solder joints, such as: how to extend soldering iron tip life, improve heat transfer, create better wetting, improve drag soldering technique and avoid cross contamination. For unlimited students at a single facility (Site License).  Also available for multiple locations (Global License).  No expiration on licensing.

Product Code: OVT-69C / Site License
IPC Member price:  $590.00
Non member price:  $740.00


Introduction to Box Build
A visual overview of system assembly, including: documentation, subassemblies and components, tools, handling, safety issues, and the step-by-step process details for building a typical electronic product. A great introduction to an often overlooked training topic.  For unlimited students at a single facility (Site License).  Also available for multiple locations (Global License).  No expiration on licensing.

Product Code: OVT-50C / Site License
IPC Member price:  $590.00
Non member price:  $740.00


Bare Board Defect Recognition
Now you can teach your entire production staff how to recognize problems BEFORE the board begins its travels down the assembly process.  Uses high-resolution close-up photography to reveal imperfections in the base material; solder mask; edge-board contacts; conductor traces, lands and CRD markings.  For unlimited students at a single facility (Site License).  Also available for multiple locations (Global License).  No expiration on licensing.

Product Code: OVT-88C / Site License
IPC Member price:  $590.00
Non member price:  $740.00

A-620A-DE
Requirements and Acceptance for Cable and Wire Harness Assemblies - German Language
This is the German language translation of IPC-WHMA-A-620A
NEW! Includes testing requirements and lead free acceptance criteria.
Revision A is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. IPC and the Wire Harness Manufacturers Association teamed to develop this significant update, adding lead free acceptance criteria, a new chapter devoted to electrical and mechanical testing, and enhanced criteria for molding and splicing.
This Revision has 599 full-color pictures and illustrations - nearly 100 new. Readability and usability were improved based on user feedback from the original release. Included in the 19 chapters are criteria for wire prep, soldering to terminals, crimping of stamped and formed contacts and machined contacts, insulation displacement connectors, ultrasonic welding, splicing, connectors, molding, marking, coax/twinax cables, wrapping/lacing, shielding, assembly and wire-wrap terminations. 368 pages. Released July 2006.
IPC Member Price $50.00
Nonmember Price $100.00

 

J-STD-004B
Requirements for Soldering Fluxes
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. This standard may be used for quality control and procurement purposes. The purpose of this standard is to classify and characterize tin/lead and lead-free soldering flux materials for use in electronic metallurgical interconnections for printed circuit board assembly. Soldering flux materials include the following: liquid flux, paste flux, solder paste, solder cream, and flux-coated and flux-cored solder wires and preforms. It is not the intent of this standard to exclude any acceptable flux or soldering material; however, these materials must produce the desired electrical and metallurgical interconnection. 20 pages. Released December 2008.
Included in the IPC-C-103 and IPC-C-1000 Collections.
IPC Member Price $36.00
Nonmember Price $72.00

WBT-55C    ESD Control for IT and Electronics Service Technicians - Web-Based Training
IPC's first true web-based training program.  For service technicians who repair electronic equipment -- in the field or on the bench. Completely automated... pay, train, test, get scored and certified online.  Cost is per student.   Also available as DVD-55C and OVT-55C.
 
DVD-88C     Bare Board Defect Recognition
Helps you to recognize and eliminate defective circuitry prior to the assembly operation.  Micro-photographic samples makes this training tool your front line of defense against producing faulty
product. Also available as OVT-88C.

DVD-50C    Introduction to Box Build
A step-by-step overview of final assembly for building a typical electronic product. Also available as OVT-50C.

CD-LFE   Lead Free Solder Joint Evaluation Tool - Class 2
                             
Automated computer-based testing for surface mount and through-hole lead free solder joints -- to see if operators / inspectors understand IPC-A-610D acceptance criteria.  For Class 2 or Class 3 product types.  Works on stand-alone PCs or over networks.

DRM-18H    Component Identification Training and Reference Guide        
Now updated to include the latest package styles... 73 pages of up-to-date information illustrating over 50 component types.

DRM-18H(S)  Component Identification Training and Reference Guide - PDF Version    
Adobe Acrobat (digital) format / Site License  of Component ID book.  Also comes in Global License.

DVD-69C    Ray's Lead Free Hand Soldering Secrets                        
How to extend soldering iron tip life, improve heat transfer, create better wetting, improve your drag soldering technique & avoid cross contamination. Also available as OVT-69C.

DVD-98C    Sign Recognition for New Employees in Electronics Assembly                
Introduces signs & labels relating to safety, ESD Control, Moisture Sensitive Devices & Lead Free soldering. Also available as OVT-98C.

DVD-79C    Handling Moisture Sensitive Devices                                
Demonstrates proper handling techniques that can prevent popcorning & component failures during solder reflow. Also available as OVT-79C.

DVD-70C    The Seven Sins of Lead Free Soldering                                        
Refresher course for anyone working in lead free assembly. Also available as OVT-70C.

 Alternate Language Releases
DVD-CH93     Chinese -- Gull Wing Rework
DVD-CHSMT-D    Chinese -- Surface Mount Solder Joint Workmanship Standards
DVD-RU54C    Russian -- ESD Control
DVD-SP78C    Spanish --  The Seven Sins of ESD Control

DVD-SP79C    Spanish --  Handling Moisture Sensitive Devices
DVD-SPPTH-D    Spanish --  Through-Hole Solder Joint Workmanship Standards
DVD-SPSMT-D    Spanish --  Surface Mount Solder Joint Workmanship Standards

Notice on E-mail Advertising

EMTF-08F
2007-2008 Industry Analysis and Forecast for Flexible Circuits in North America
Survey-based study presents data and analysis on trends in the North American flexible circuit industry, including growth estimates and sales history, number of fabricators, global footprint of North American fabricators, trends in materials, sales by product type, production mix (high-volume vs. quick-turn vs. prototype), trends in line width and spacing, revenue trends from value-added services, industry end-markets by product type, and U.S. imports and exports. Survey sample of five companies represents 81% of North American flexible circuit production. 41 total pages. Released November 2008.
Preview the table of contents .pdf file. 
IPC Member Price $475.00
Nonmember Price $950.00
   
EMTF-08R
2007-2008 Industry Analysis and Forecast for Rigid PCBs in North America
Survey-based study presents data and analysis on trends in the North American rigid PCB industry, including industry growth forecast, industry end-markets served, sales history by product type, trends in high-density multilayer boards, production mix trends (high-volume vs. quick-turn vs prototype), number and average value of PCBs and panels produced, and US imports and exports. Survey sample of 12 companies represents about 31% of the rigid PCB industry in North America. 50 total pages. Released November 2008.
Preview the table of contents .pdf file. 
IPC Member Price $475.00
Nonmember Price $950.00

WAGEAE-08
IPC Wage Rate & Salary Study for Assembly Equipment Industry 2007-2008
This 26-page report contains the results of IPC's wage and salary survey for the assembly equipment industry in North America for 2007-2008. It presents aggregate data on 41 positions and the related job descriptions. Current wage and salary data are shown by regions and by company size. The report also includes aggregate data on the respondents' personnel and compensation policies, benefits, and sales compensation structure. Thirteen major companies participated in this study. Published in November 2008
IPC Member Price $1,000.00
Nonmember Price $2,000.00

EMTF-08F
2007-2008 Industry Analysis and Forecast for Flexible Circuits in North America
Survey-based study presents data and analysis on trends in the North American flexible circuit industry, including growth estimates and sales history, number of fabricators, global footprint of North American fabricators, trends in materials, sales by product type, production mix (high-volume vs. quick-turn vs. prototype), trends in line width and spacing, revenue trends from value-added services, industry end-markets by product type, and U.S. imports and exports. Survey sample of five companies represents 81% of North American flexible circuit production. 41 total pages. Released November 2008.
Preview the table of contents .pdf file. 
IPC Member Price $475.00
Nonmember Price $950.00
   
    
EMTF-08R
2007-2008 Industry Analysis and Forecast for Rigid PCBs in North America
Survey-based study presents data and analysis on trends in the North American rigid PCB industry, including industry growth forecast, industry end-markets served, sales history by product type, trends in high-density multilayer boards, production mix trends (high-volume vs. quick-turn vs prototype), number and average value of PCBs and panels produced, and US imports and exports. Survey sample of 12 companies represents about 31% of the rigid PCB industry in North America. 50 total pages. Released November 2008.
Preview the table of contents .pdf file. 
IPC Member Price $475.00

Nonmember Price $950.00

IPC/ECA J-STD-002C
AMENDMENT 1

Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires
This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. This standard addresses both visual acceptance and force measurement solderability criteria for both tin-lead as well as lead-free solder processes. This standard also includes a test method for the Resistance to Dissolution/Dewetting of Metallization to verify that metallized terminations will remain intact throughout the assembly soldering processes. This standard is intended for use by both vendors and users. 62 pages. Released December 2007.

Download the Free Amendment 1 to IPC/ECA J-STD-002C  (.pdf file) here.

 

EMTF-08IEM
A New Look at Opportunities in the Industrial Electronics Market
This 77-page study was developed by Prismark Partners, one of the world's leading market research consultancies to the electronic interconnect industry. The study defines the major segments of the industrial electronics market, addressing the major product types and technologies, the size and recent growth of these segments, as well as forecasts of future growth. It focuses on the major market opportunities for the EMS, PCB and supplier industries, as well as the technology challenges in these segments. Published October 2008.
Preview the table of contents .pdf file.
IPC Member Price $1,200.00
Nonmember Price $2,400.00

This report is free for members of the IPC Executive Forum and will be available for free to IPC members after January 1, 2009. To purchase, follow the link above or visit www.ipc.org/onlinestore.


 

 
 
   
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