J Standard Soldering Process
J standard CIS Certified IPC Specialist
This is a comprehensive, hands-on solder training program based on J-STD-001. The program describes materials, methods and verification criteria for producing high quality soldered interconnections. The standard emphasizes process control and sets industry consensus requirements for a broad range of electronic products.
The operator proficiency program consists of five modules detailed below. Candidates must successfully complete module one and then can take any other module/modules consistent with their job requirements.
All written exam grades for Modules completed will be averaged together. The minimum score for successful completion is 70%. The minimum score for each lab session is also 70%.
Upon successful completion of the course students will receive an IPC J-STD-001 Certified IPC Specialist certification good for two years.
This module is an introduction and overview to the entire contents of J-STD-001 Rev. F and is a prerequisite to any of the following four technical specific modules. Module 1 consists of lecture, review, and an open and closed book written exam.
Wires and Terminals
This module provides requirements for wire and terminal applications consisting of lecture, review, and instructor demonstrations. The students will prepare and solder wires to turret, bifurcated, J-hook, pierced, and cup terminals. Students must demonstrate proficiency in preparing and soldering wires to the above terminal types and pass the open book exam.
This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the end open book exam.
Surface Mount Technology (SMT)
This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include 1206 through 0402 chips, SOIC’s, PLCC’s, SOT’s, QFP’s, TSOP’s, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an open book examination.
This module provides requirements for inspection methodology and a basic introduction to process control issues. Through lecture and actual inspections of a sample PCB the student will demonstrate their proficiency in identifying acceptable and defective conditions according to the Standard. An open book examination is also required.
Course Synopsis PDF
Our free course overview and schedule will provide insight into the hours and required modules as well as highlight optional certifications within the program.
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Optional Space Addendum Module
J-STD-001FS space addendum includes additional requirements over those published in J-STD-001F. The space community felt the base document does not adequately cover requirements that will help hardware survive the rigorous thermal cycles and intense vibration the hardware will be exposed to during acceptance and/or qualification testing, as well as during launch and mission life. There are also materials issues for hardware that will be in a micro-atmosphere (vacuum) environment. Although these are largely the responsibility of the design activity, some requirements in J-STD-001FS space addendum are intended to provide default materials requirements, or to at least initiate a discussion between manufacturing and the design activity.
ANSI approved lead free acceptance criteria. World recognized as the sole industry consensus standard covering soldering materials and processes, includes criteria for lead free manufacturing, materials, methods and verification for producing quality soldered interconnections and assemblies.
Solderability tests for component leads terminations, lugs, terminals and wires. Test method choices, defect definitions, acceptance criteria and illustrations for both the supplier and user.
Solderability for printed boards Industry recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated-through holes. Test methods covered include edge dip, rotary dip, solder float, wave solder, and wetting balance.
Requirements for Soldering Fluxes. Covers requirements for qualification and classification of rosin, organic, and inorganic fluxes according to activity level and halide content of the fluxes. Includes flux containing materials and low residue fluxes for no clean processes.
Requirements for Soldering Pastes Covers requirements for qualification and characterization of solder paste. Test methods and criteria for metal content, viscosity, slump, solder ball, tack and wetting of solder paste.
Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications. Prescribes the nomenclature, requirements and test methods for electronic grade solder alloys, fluxed and non-fluxed bar, ribbon, and powder solder; electronic soldering applications and “ special ” electronic grade solders. This is a quality control standard and is not intended to relate directly to the materials performance in the manufacturing process.